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US 11,699,672 B2Granted
Semiconductor device and method for manufacturing same
AssigneeDenso Corporation
InventorsMariko Fujieda, Kazuaki Mawatari, Shinji Kawano
Life of this patent
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Abstract
A semiconductor device includes a pad formed on a surface of a substrate, a bonding wire for connecting the pad to an external circuit, and a resin layer covering at least a connection portion between the pad and the bonding wire and exposing at least a part of the substrate outside the pad.
Claims5
A semiconductor device comprising:
- a pad arranged on a surface of a substrate, the substrate including a plate-like glass base and a silicon substrate attached to an upper surface of the plate-like glass base;
- a bonding wire connecting the pad to an external circuit;
- a resin layer covering at least a connection portion between the pad and the bonding wire and exposing at least a part of the substrate outside the pad;
- a protection film made of a paraxylylene polymer and arranged on an upper surface of the resin layer, wherein:
- the resin layer has a smaller amount of liquid and gas permeation than the protection film.
2 more elements
Dependencies are inferred from the claim text.