High-frequency module
AssigneeMurata Manufacturing Co., Ltd.
InventorsYoshihito Otsubo, Akihiro Fujii
Life of this patent
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Abstract
A module that improves heat-dissipation efficiency and can prevent a warp and a deformation of the module is provided. A module includes a substrate, a first component mounted on an upper surface of the substrate, a heat-dissipation member, and a sealing resin layer that seals the first component and the heat-dissipation member. The heat-dissipation member is formed to be larger than the area of the first component when viewed in a direction perpendicular to the upper surface of the substrate and prevents heat generation of the module by causing the heat generated from the first component to move outside the module. The heat-dissipation member has through holes, and the through holes are packed with a resin, which can prevent the sealing resin layer from peeling off.
Claims13
A high-frequency module comprising:
- a substrate;
- a first component mounted on a major surface of the substrate;
- a heat-dissipation member disposed in contact with a surface of the first component opposite to a surface of the first component facing the major surface of the substrate;
- and
- a sealing resin layer sealing the major surface of the substrate, the first component, and the heat-dissipation member,
- wherein the heat-dissipation member has an area larger than an area of the first component when viewed in a direction perpendicular to the major surface of the substrate,
- wherein the heat-dissipation member has a plurality of through holes in a region that does not overlap the first component when viewed in the direction perpendicular to the major surface of the substrate, and
- wherein a resin constituting the sealing resin layer is also packed in the plurality of through holes.
Dependencies are inferred from the claim text.