Semiconductor device package having warpage control and method of forming the same

A semiconductor device package, comprising:

• a substrate having a first surface;
• an electronic component over the first surface of the substrate;
• a ring structure over the first surface of the substrate and surrounding the electronic component, wherein the ring structure is spaced from the electronic component, wherein the ring structure has a bottom surface facing the first surface of the substrate and a top surface opposite the bottom surface, and the ring structure includes a plurality of side parts and a plurality of corner parts recessed from the top surface and thinner than the side parts, wherein the side parts each have a first height, and the corner parts each have a second height that is lower than the first height, wherein the second height is less than about ¾ of the first height and greater than about ¼ of the first height, wherein any two of the corner parts are separated from one another by one of the side parts;
• and
• a first adhesive layer interposed between the bottom surface of the ring structure and the first surface of the substrate.

A method for forming a semiconductor device package, comprising:

• attaching an electronic component to a surface of a substrate;
• applying an adhesive layer to a periphery of the surface of the substrate;
• and
• mounting a ring structure on the periphery of the surface of the substrate via the adhesive layer, wherein the ring structure is spaced from the electronic component, wherein the ring structure has a bottom surface facing the surface of the substrate and a top surface opposite the bottom surface, and the ring structure includes a first part having a first height and a second part recessed from the top surface and having a second height that is lower than the first height, wherein the second height is less than about ¾ of the first height and greater than about ¼ of the first height, wherein the second part of the ring structure includes a plurality of segmented parts corresponding to respective corners of the substrate, and any two of the segmented parts are separated from one another by the first part.