Semiconductor device and power conversion device

A semiconductor device comprising:

• an insulating substrate having a front surface and a back surface, and having a semiconductor element joined to the front surface;
• a base plate joined to the back surface of the insulating substrate;
• a case surrounding the insulating substrate;
• a filler having an upper surface, covering the insulating substrate, and filling a region surrounded by the base plate and the case;
• and
• a metal plate including an inclined portion that is angled upwardly toward an upper surface side of the filler inside the filler, the metal plate having one end joined to the front surface of the insulating substrate and another end separated from an inner wall of the case, and being exposed from the upper surface of the filler,
• the inclined portion of the metal plate being angled toward the upper surface side of the filler in a cross section in a direction crossing a direction connecting the one end and the other end,
• wherein the inclined portion has a horizontal component that is longer than any vertical portion of the metal plate, and
• wherein the metal plate includes a vertical portion where the metal plate protrudes through the upper surface of the filler.

A semiconductor device comprising:

• an insulating substrate having a front surface and a back surface, and having a semiconductor element joined to the front surface;
• a base plate joined to the back surface of the insulating substrate;
• a case surrounding the insulating substrate;
• a filler having an upper surface, covering the insulating substrate, and filling a region surrounded by the base plate and the case;
• and
• a metal plate including an inclined portion that is angled upwardly toward an upper surface side of the filler inside the filler, the metal plate having, one end joined to the front surface of the insulating substrate and another end separated from an inner wall of the case, and being exposed from the upper surface of the filler,
• the inclined portion of the metal plate being angled toward the upper surface side of the filler in a cross section in a direction crossing a direction of a current flowing through the metal,
• wherein the inclined portion has a horizontal component that is longer than any vertical portion of the metal plate, and
• wherein the metal plate includes a vertical portion where the metal plate protrudes through the upper surface of the filler.