Semiconductor module

A semiconductor module comprising:

• a main board;
• a plurality of external terminals disposed on an upper surface of the main board;
• a package substrate including a core insulation layer, a conductive pattern disposed in the core insulation layer and configured to be electrically connected with the plurality of external terminals, an upper insulation pattern and a lower insulation pattern, the upper insulation pattern is disposed on an upper surface of the core insulation layer and partially exposes the conductive pattern, and the lower insulation pattern is disposed on a lower surface of the core insulation layer and partially exposes the conductive pattern;
• at least one semiconductor chip disposed on an upper surface of the package substrate and configured to be electrically connected with the conductive pattern;
• a molding member disposed on the upper surface of the package substrate and covering the at least one semiconductor chip;
• a shielding plate disposed on an upper surface and lateral side surfaces of the molding member and lateral side surfaces of the package substrate and configured to shield electromagnetic interference (EMI) emitted from the at least one semiconductor chip;
• and
• a shielding fence disposed between an edge portion of a lower surface of the lower insulation pattern and the upper surface of the main board, the shielding fence surrounds the plurality of extern al terminals and is configured to shield EMI emitted from the external terminals.

A semiconductor module comprising:

• a main board;
• a plurality of external terminals disposed on an upper surface of the main board;
• a semiconductor package disposed over the main board, the semiconductor package including a shielding fence surrounding the external terminals and configured to shield electromagnetic interference (EMI) emitted from the external terminals, wherein the plurality of external terminals is configured to electrically connect the semiconductor package with the main board;
• and
• a shielding plate disposed on an upper surface and lateral side surfaces of a molding member and lateral side surfaces of the package substrate;
• and
• a shielding fence surrounding the semiconductor package, the shielding fence electrically connecting to a ground terminal among the external terminals and the shielding fence is configured to discharge an EMI emitted from the semiconductor package through the ground terminal.