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US 11,699,664 B2Granted
Wrappable EMI shields
AssigneeIntel Corporation
InventorsEng Huat Goh, Tin Poay Chuah, Yew San Lim, Min Suet Lim
Life of this patent
Estimating the term…
Abstract
According to the various aspects, the present device includes a printed circuit board having a top surface and a bottom surface, with a plurality of semiconductor devices coupled to the top surface and a flexible electromagnetic shield wrap conformally positioned over and between the plurality of semiconductor devices and the top surface of the printed circuit board. The flexible electromagnetic shield wrap is conformally positioned by applying a vacuum and is removable after the vacuum seal is broken.
Claims15
A device comprising:
- a printed circuit board comprising a top surface and a bottom surface;
- a plurality of semiconductor devices coupled to the top surface of the printed circuit board;
- and
- a flexible electromagnetic shield wrap conformally positioned over and between the plurality of semiconductor devices and on the top surface, the bottom surface, and a side surface of the printed circuit board;
- further comprising an opening between the top surface and the bottom surface of the printed circuit board, wherein within the opening a portion of the flexible electromagnetic shield wrap covering the top surface is in contact with another portion of the flexible electromagnetic shield wrap covering the bottom surface.
2 more elements
Dependencies are inferred from the claim text.