Electronic device package and method of manufacturing the same

An electronic device package, comprising:

• a first electronic component;
• and
• a redistribution layer (RDL) disposed above the first electronic component and electrically connected to the first electronic component, wherein the RDL comprises:
• a circuit layer comprising a first conductive pad and a second conductive pad, wherein the first conductive pad includes:
• a first pad portion having a curved edge and a center of curvature, and a first extension portion protruding from the first pad portion and having a curved edge and a center of curvature;
• and wherein the second conductive pad includes:
• a second pad portion having a curved edge and a center of curvature, and a second extension portion protruding from the second pad portion and having a curved edge and a center of curvature;
• wherein a first imaginary straight line connecting the center of curvature of the first pad portion and the center of curvature of the second pad portion is non-parallel to a second imaginary straight line connecting the center of curvature of the first extension portion and the center of curvature of the second extension portion.