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US 11,699,649 B2Granted
Electronic device having inverted lead pins
AssigneeTexas Instruments Incorporated
InventorsChang-Yen Ko, J K Ho
Life of this patent
Estimating the term…
Abstract
An electronic device (e.g., integrated circuit) and method of making the electronic device is provided that reduces a strength of an electric field generated outside a package of the electronic device proximate to the low voltage lead pins. The electronic device includes a low voltage side and a high voltage side. The low voltage side includes a low voltage die attached to a low voltage die attach pad. Similarly, the high voltage side includes a high voltage die attached to a high voltage die attach pad. Lead pins are attached to each of the low and high voltage attach pads and extend out from a package of the electronic device in an inverted direction.
Claims20
An electronic device, comprising:
- a package having a longitudinal center line, a mounting portion on one side of the longitudinal center line and a non-mounting portion on an opposite side of the longitudinal center line;
- a die attach pad embedded in the mounting portion of the package, the die attach pad having a first side facing toward the longitudinal center line and a second side facing away from the longitudinal center line;
- a die attached to the first side of the die attach pad;
- and
- a plurality of lead pins extending from the package in a direction toward the mounting portion and away from the non-mounting portion of the package.
2 more elements
An electronic device, comprising:
- a package having a longitudinal center line, a mounting portion on one side of the longitudinal center line and a non-mounting portion on an opposite side of the longitudinal center line;
- a die attach pad embedded in the mounting portion of the package, the die attach pad having a first side facing toward the longitudinal center line and a second side facing away from the longitudinal center line;
- a die attached to the first side of the die attach pad;
- a plurality of lead pins extending from the package in a direction toward the mounting portion and away from the non-mounting portion of the package;
- a power enhancing device attached to the die attach pad, wherein the power enhancing device increases power supplied to the die attach pad;
- and
- a plurality of lead pins extending from the package in the direction toward the mounting portion and away from the non-mounting portion of the package.
4 more elements
An integrated circuit, comprising:
- a package having a longitudinal center line extending from one side of the package to another side;
- a die attach pad embedded in the package, the die attach pad having a first side facing toward the longitudinal center line and a second side facing away from the longitudinal center line, the die attach pad being displaced at a first offset from the longitudinal center line;
- a die attached to the first side of the die attach pad;
- and
- a plurality of lead pins extending from the package in a direction away from the longitudinal center line and opposite a direction of the first offset.
2 more elements
An integrated circuit, comprising:
- a package having a longitudinal center line extending from a first side of the package to a second side;
- a die attach pad embedded in the package, the die attach pad having a first side facing toward the longitudinal center line and a second side facing away from the longitudinal center line, the die attach pad being displaced at a first offset from the longitudinal center line;
- a die attached to the first side of the attach pad;
- a plurality of lead pins extending from the package in a direction away from the longitudinal center line and opposite a direction of the first offset;
- wherein the die attach pad includes an extended portion displaced at a second offset from the longitudinal center line of the package, and wherein a power enhancing device is attached to the extended portion of the die attach pad;
- and
- a plurality of lead pins extending from the package in the direction away from the longitudinal center line and opposite the direction of the first offset.
4 more elements
A method comprising:
- attaching a die to a die attach pad;
- attaching a first end of at least one lead pin to the die attach pad;
- placing the die in a cavity defined in a package body of an integrated circuit;
- encapsulating the die and the die attach pad in a package of the integrated circuit, wherein the die attach pad is displaced from a longitudinal center line of a package of the integrated circuit at a first offset in a direction toward a mounting portion of the package;
- and
- bending a second end of the at least one lead pin disposed outside the package in a direction away from the longitudinal center line of the package and opposite the direction of the first offset.
3 more elements
A method comprising:
- attaching a die to a die attach pad;
- attaching a first end of at least one lead pin to the die attach pad;
- placing the die in a cavity defined in a package body of an integrated circuit;
- encapsulating the die and the die attach pad in a package of the integrated circuit, wherein the die attach pad is displaced from a longitudinal center line of a package of the integrated circuit at a first offset in a direction toward a mounting portion of the package;
- and
- bending a second end of the at least one lead pin disposed outside the package in a direction away from the longitudinal center line of the package and opposite the direction of the first offset, wherein prior to bending a second end of the at least one lead pin, the method further includes removing the package from a mold.
3 more elements
Dependencies are inferred from the claim text.