Electromigration resistant and profile consistent contact arrays

A composite device assembly comprising:

• a plurality of dies, each die of the plurality of dies includes a respective array of contacts;
• a substrate extending from a first substrate end to a second substrate end, the plurality of dies are coupled along the substrate, the substrate includes:
• one or more interconnect bridges having associated conductive traces, the one or more interconnect bridges configured to interconnect the plurality of dies;
• and
• a plurality of via assemblies;
• and
• each via assembly of the plurality of via assemblies is interposed between the array of contacts of a die of the plurality of dies and the conductive traces of an interconnect bridge of the one or more interconnect bridges, each via assembly includes:
• a base pad in communication with a conductive trace of the interconnect bridge, the base pad including a first conductive material;
• a structure in communication with a contact of the first array of contacts, the structure including a solder layer including a second conductive material different from the first conductive material, and the structure including a material layer, the material comprises a metal selected from the group consisting of nickel, cobalt and iron, the solder layer on the material layer, the material layer having a third conductive material different from the first and second conductive materials, the material layer configured to isolate each of the base pad and the solder layer from intermetallic compound growth;
• and
• a via between the base pad and the structure, the via including the first conductive material.