Pre-molded lead frames for semiconductor packages
AssigneeInfineon Technologies AG
InventorsBalehithlu Manjappaiah Upendra, Romel Solanoy Lazala, Dexter Inciong Reynoso, Mohamad Yazid Bin Wagiman
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Abstract
One example of a pre-molded lead frame includes a mold body, a plurality of recesses, and a plurality of first leads. The mold body includes a first main surface and a second main surface opposite to the first main surface. Each recess of the plurality of recesses extends from the first main surface into the mold body. The plurality of first leads are coupled to the mold body and extend from a third surface of the mold body. The third surface extends between the first main surface and the second main surface.
Claims20
A pre-molded lead frame comprising:
- a mold body comprising a first main surface and a second main surface opposite to the first main surface;
- a plurality of recesses separated from each other by the mold body, each recess of the plurality of recesses extending from the first main surface into the mold body;
- and
- a plurality of first leads coupled to the mold body and extending from a third surface of the mold body, the third surface extending between the first main surface and the second main surface.
A semiconductor package comprising:
- a pre-molded lead frame comprising a mold body comprising a first main surface and a second main surface opposite to the first main surface, at least two recesses separated from each other within the mold body and extending from the first main surface into the mold body, and a plurality of first leads coupled to the mold body;
- a first semiconductor die attached to the mold body within a first recess of the at least two recesses by a first adhesive material layer;
- a second semiconductor die attached to the mold body within a second recess of the at least two recesses by a second adhesive material layer;
- and
- a plurality of first electrical connections, each first electrical connection of the plurality of first electrical connections electrically coupling a respective first lead of the plurality of first leads to at least one of the first semiconductor die and the second semiconductor die.
A semiconductor package comprising:
- a pre-molded lead frame comprising a mold body comprising a first main surface and a second main surface opposite to the first main surface, at least two recesses within the mold body extending from the first main surface into the mold body, and a plurality of first leads coupled to the mold body;
- a first semiconductor die attached to the mold body within a first recess of the at least two recesses by a first adhesive material layer;
- a second semiconductor die attached to the mold body within a second recess of the at least two recesses by a second adhesive material layer;
- and
- a plurality of first electrical connections, each first electrical connection of the plurality of first electrical connections electrically coupling a respective first lead of the plurality of first leads to at least one of the first semiconductor die and the second semiconductor die,
- wherein a depth of the first recess is greater than or equal to a thickness of the first semiconductor die and a depth of the second recess is greater than or equal to a thickness of the second semiconductor die.
Dependencies are inferred from the claim text.