Power semiconductor module for PCB embedding, power electronic assembly having a power module embedded in a PCB, and corresponding methods of production

A method of batch producing power modules, the method comprising:

• applying a first solder paste to substrate sections of a leadframe structure, wherein each substrate section belongs to a different one of the power modules;
• placing a power semiconductor die on the first solder paste of each substrate section, each power semiconductor die having a first load terminal and a control terminal at a first side that faces away from the leadframe structure and a second load terminal contacting the first solder paste at a second side opposite the first side;
• applying a second solder paste to the first load terminal and the control terminal of each power semiconductor die;
• vertically aligning a metal clip frame with the leadframe structure, the metal clip frame comprising a first metal clip vertically aligned with the first load terminal of each power semiconductor die and a second metal clip vertically aligned with the control terminal of each power semiconductor die;
• pressing the metal clip frame toward the leadframe structure in a pressing direction, wherein a hard stop feature prevents further pressing when the hard stop feature is engaged;
• reflowing the first solder paste and the second solder paste to form a first soldered joint between each first metal clip and the corresponding first load terminal of each power semiconductor die, a second soldered joint between each second metal clip and the corresponding control terminal of each power semiconductor die, and a third soldered joint between the second load terminal of each power semiconductor die and the corresponding substrate section of the leadframe structure;
• and
• severing connections to the leadframe structure and to the metal clip frame, to form individual power modules.