Water cooled plate for heat management in power amplifiers
AssigneeApplied Materials, Inc.
InventorsRibhu Gautam, Ananthkrishna Jupudi, Vinodh Ramachandran
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Abstract
Methods and apparatus for a cooling plate for solid state power amplifiers are provided herein. In some embodiments, a cooling plate of a solid state power amplifier includes a body having a rectangular shape, a first sidewall opposite a second sidewall, and a third sidewall opposite a fourth sidewall; a plurality of holes disposed on a first side of the body configured to mount a plurality of heat generating microelectronic components; and a channel having a plurality of segments disposed within the body and extending from a first port disposed on the first sidewall to a second port disposed on the first sidewall.
Claims18
A cooling plate of a solid state power amplifier, comprising:
- a body having a rectangular shape including a first sidewall opposite a second sidewall and a third sidewall opposite a fourth sidewall, wherein the body includes a recess proximate the first sidewall that includes cutouts extending entirely through the body to accommodate components of the solid state power amplifier;
- a plurality of holes disposed on a first side of the body configured to mount a plurality of heat generating microelectronic components;
- and
- a channel having a plurality of segments disposed within the body and extending from a first port disposed on the first sidewall to a second port disposed on the first sidewall, wherein at least one segment of the plurality of segments extends through the fourth sidewall, wherein a first segment of the plurality of segments is a continuous linear segment that extends from the first port to a first junction, a second segment of the plurality of segments is a continuous linear segment that extends from the first junction to a second junction, a third segment of the plurality of segments extends from the second junction towards the second port, and a last segment of the plurality of segments extends from the second port, and wherein each of the plurality of segments extend only partially through the body.
A solid state power amplifier, comprising:
- a cooling plate having a first side configured to mount a plurality of heat generating microelectronic components and a channel disposed within the cooling plate and extending from an inlet to an outlet, wherein the inlet and the outlet are disposed on a first sidewall of the cooling plate, wherein the channel is configured to circulate a coolant, wherein the cooling plate has a thickness of about 15.0 mm to about 45.0 mm, wherein the channel includes a plurality of segments, wherein at least one segment of the plurality of segments extends through a sidewall orthogonal to the first sidewall,
- wherein the cooling plate includes a recess proximate the first sidewall that includes cutouts extending entirely through the cooling plate to accommodate components of the solid state power amplifier, and
- wherein the cooling plate includes a second recess proximate a second sidewall of the cooling plate, and a first guide channel extending from the second sidewall through the second recess to at least one of the plurality of segments.
A method of cooling a solid state power amplifier, comprising:
- drilling sidewalls of a cooling plate to a location disposed within the cooling plate without extending through the cooling plate to create a plurality of segments that define a channel within the cooling plate extending from an inlet to an outlet, wherein the inlet and the outlet are disposed on a first sidewall of the cooling plate and the channel has a substantially uniform cross-sectional area, wherein the cooling plate includes a recess to accommodate components of the solid state power amplifier, wherein the cooling plate has a first side configured to mount a plurality of heat generating microelectronic components, and wherein the channel is configured to circulate a liquid coolant;
- drilling a guide channel from the recess to the channel;
- plugging the guide channel adjacent the recess to prevent flow of the liquid coolant from the guide channel to the recess;
- and
- flowing a liquid coolant from a coolant source through the channel.
Dependencies are inferred from the claim text.