Pressure balancing clamp for press-pack insulated gate bipolar transistor module

A pressure balancing clamp for a press-pack insulated gate bipolar transistor (IGBT) module, comprising:

• a bracket, wherein the bracket is slidably installed with pressure equalizing plates, and two pressure equalizing plates are longitudinally arranged, and the pressure equalizing plates are connected with each other through pressure sensors;
• upper and lower ends inside the bracket are respectively connected with the pressure equalizing plates through hydraulic devices and a displacement compensation device;
• opposite faces of the two pressure equalizing plates are respectively provided with heat dissipation and confluence devices, and the two heat dissipation and confluence devices clamp and fix the press-pack IGBT module;
• wherein at least three hydraulic devices are arranged and are sequentially arranged along a circumferential direction of the press-pack IGBT module, the pressure sensors and the hydraulic devices are longitudinally arranged in one-to-one correspondence, and the longitudinally corresponding hydraulic devices and the pressure sensors are electrically connected, and the hydraulic devices adjust according to pressure sensed by the pressure sensors in corresponding directions;
• the bracket comprises a lower top plate and an upper top plate, wherein the lower top plate and the upper top plate are longitudinally arranged correspondingly, and opposite surfaces are connected by guide rods;
• and the pressure equalizing plates are slidably connected with the guide rods by opening guide holes;
• an upper surface of the lower top plate is fixedly connected with the displacement compensation device, and a lower surface of the upper top plate is fixedly connected with the hydraulic devices;
• the heat dissipation and confluence devices comprise heat dissipation and confluence structures;
• two heat dissipation and confluence structures are symmetrically arranged up and down, and the opposite faces of the two pressure equalizing plates are respectively connected with the heat dissipation and confluence structures, and the two heat dissipation and confluence structures clamp and fix the press-pack IGBT module;
• the heat dissipation and confluence devices further comprise insulating plates, and the insulating plates are arranged at joints of the pressure equalizing plates and the heat dissipation and confluence structures;
• and
• through holes are formed in side walls of the heat dissipation and confluence structures, and arc-shaped protrusions and strip-shaped grooves are respectively arranged on opposite surfaces of the two heat dissipation and confluence structures, and the strip-shaped grooves run through gaps of the arc-shaped protrusions;
• confluence ends of the heat dissipation and confluence structures are provided with three lead-out holes.