Semiconductor device and manufacturing method thereof

A semiconductor device, comprising:

• a circuit substrate;
• first semiconductor dies connected to a first side of the circuit substrate;
• a second semiconductor die connected to the first side of the circuit substrate, wherein the second semiconductor die is connected to the circuit substrate beside the first semiconductor dies;
• and
• a package lid, disposed on the circuit substrate and comprising:
• a roof, horizontally extending over the circuit substrate along a first direction and a second direction,
• a footing, shaped as a frame at the edge of the roof and supporting the package lid on the circuit substrate;
• an island, protruding from the roof in correspondence of the second semiconductor die and entirely separated from the footing along the first direction;
• and
• ribs, protruding from the roof, and extending between the footing and the island along the second direction,
• wherein the island is physically connected to the footing along the second direction by the rib, and the second semiconductor die is contained within a vertical projection of the island.

A manufacturing method of a semiconductor device, comprising:

• bonding a first semiconductor die to a circuit substrate;
• disposing a first adhesive on the circuit substrate, wherein the first adhesive encircles the first semiconductor die;
• disposing a first thermal interface material on a rear surface of the first semiconductor die;
• and
• adhering a package lid to the circuit substrate, wherein the package lid comprises:
• a roof, extending parallel to the circuit substrate along a first direction and a second direction perpendicular to the first direction;
• a footing, having a thickness along a third direction perpendicular to the first direction and the second direction greater than a thickness of the roof;
• an island, having a thickness along the third direction greater than the thickness of the roof, and entirely separated from the footing along the first direction;
• and
• ribs, having a same thickness as the island along the third direction, and extending along the second direction between the island and the footing, wherein the island is physically connected to the footing along the second direction by the rib,
• wherein adhering the package lid to the circuit substrate comprises disposing the package lid over the circuit substrate so that the island contacts the first thermal interface material on the rear surface of the first semiconductor die and the footing overlies the first adhesive.