Thermals for packages with inductors

An integrated circuit device package comprising:

• an integrated circuit die;
• and
• a package substrate coupled with the integrated circuit die, wherein the package substrate comprises:
• one or more pads comprising metal on a first substrate surface, the one or more pads coupled with contacts of the integrated circuit die;
• one or more substrate layers comprising dielectric material;
• one or more conductive contacts on a second substrate surface, opposite the first substrate surface, the one or more conductive contacts to couple with contacts of a printed circuit board;
• one or more inductors on the one or more substrate layers, the one or more inductors coupled with the one or more conductive contacts and the one or more pads;
• and
• underfill material between the second substrate surface and a printed circuit board surface, the underfill material contacting the one or more inductors and the underfill material comprising a thermal conductivity of greater than 0.5 watts per meter-kelvin (W/(mK)).

A system comprising:

• a printed circuit board;
• one or more components coupled with the printed circuit board;
• and
• an integrated circuit device package coupled with the printed circuit board, wherein the integrated circuit device package comprises:
• an integrated circuit die;
• and
• a package substrate coupled with the integrated circuit die, wherein the package substrate comprises:
• one or more pads comprising metal on a first substrate surface, the one or more pads coupled with contacts of the integrated circuit die;
• one or more substrate layers comprising dielectric material;
• one or more conductive contacts on a second substrate surface, opposite the first substrate surface, the one or more conductive contacts coupled with contacts of the printed circuit board;
• one or more inductors on the one or more substrate layers, the one or more inductors coupled with the one or more conductive contacts and the one or more pads;
• and
• underfill material between the second substrate surface and a surface of the printed circuit board, the underfill material contacting the one or more inductors and the underfill material is limited to a location interior to the conductive contacts.