Power semiconductor module arrangement

A mounting arrangement, comprising:

• a frame or body;
• a first terminal element;
• and
• a second terminal element;
• wherein the mounting arrangement is configured to be inserted in and coupled to a housing of a power semiconductor module arrangement comprising first and second electrical contacts arranged in the housing,
• wherein first ends of the first and second terminal elements, when the mounting arrangement is inserted in and coupled to the housing, are configured to mechanically and electrically contact the first and second electrical contacts, respectively,
• wherein a middle part of each of the first and second terminal elements extends through the frame or body,
• wherein a second end of each of the first and second terminal elements, when the mounting arrangement is inserted in and coupled to the housing, extends outside the housing,
• wherein the first terminal element is dielectrically insulated from the second terminal element by a portion of the frame or body,
• wherein the first terminal element is injected into and inextricably coupled to the frame or body,
• wherein the second terminal element is arranged within a hollow space inside the frame or body and is detachably coupled to the frame or body.