Automated transfer and drying tool for process chamber

An integrated chip processing tool for processing a singulated semiconductor die, comprising:

• a processing tool comprising:
• a first housing that surrounds a first chamber;
• an evaluation unit disposed within the first chamber and configured to subject the singulated semiconductor die to a liquid;
• an automated transfer and drying tool comprising:
• a second housing that surrounds a second chamber;
• a multi-axis robot configured to pick-up the singulated semiconductor die, and transfer the singulated semiconductor die from the second chamber to the first chamber for processing of the singulated semiconductor die by the evaluation unit, and further configured to, after the singulated semiconductor die has been processed by the evaluation unit, transfer the singulated semiconductor die to a drying unit configured to dry an upper surface of the singulated semiconductor die.