Substrate fixing device, electrostatic chuck and electrostatic chuck manufacturing method

A substrate fixing device comprising:

• a base plate;
• and
• an electrostatic chuck that is fixed to the base plate to adsorb a substrate by electrostatic force, the electrostatic chuck comprising:
• an adsorption layer that is formed of ceramic and that contacts the substrate to adsorb and hold the substrate;
• a first heating layer that is formed on the adsorption layer and that includes a first electrode configured to generate heat;
• a second heating layer that is formed on the first heating layer and that includes a second electrode configured to generate heat;
• and
• a via that is provided between the first electrode and the second electrode to electrically connect the first electrode and the second electrode to each other:
• wherein the via comprises a body portion, and an end portion that is connected to the body portion,
• the body portion penetrates at least one of the first electrode and the second electrode,
• the end portion is formed on the at least one of the first electrode and the second electrode which the body portion penetrates, and
• a diameter of the end portion is larger than that of the body portion.