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US 11,699,605 B2Granted
Apparatus for treating substrate
AssigneeSemes Co., Ltd.
InventorsKyungsik Shin, Jung-Hyun Lee, Jinki Shin, Seo Jung Park
Life of this patent
Estimating the term…
Abstract
An apparatus for treating a substrate includes a chamber having a treating space formed therein, a substrate support unit that supports the substrate in the treating space, a plate that is located to face the substrate support unit in the treating space and that has a plurality of holes formed therein, a gas supply unit that supplies gas into the treating space through the holes, and a gas exhaust unit that exhausts the gas in the treating space through the holes.
Claims20
An apparatus for treating a substrate, the apparatus comprising:
- a chamber having a treating space formed therein;
- a substrate support unit configured to support the substrate in the treating space;
- a plate located to face the substrate support unit in the treating space, the plate having a plurality of holes formed therein;
- a gas supply unit configured to supply gas into the treating space through the holes;
- and
- a gas exhaust unit configured to exhaust the gas in the treating space through the holes,
- wherein the plate has a plurality of first exhaust holes and a plurality of first supply holes formed in a central area thereof, the first exhaust holes being configured to exhaust the gas in an intervening space between the plate and the substrate support unit, and the first supply holes being surrounded by the first exhaust holes and configured to supply the gas into the intervening space, and
- wherein the plate has a plurality of second supply holes formed outside the central area thereof, the second supply holes being configured to supply the gas into the intervening space.
5 more elements
An apparatus for treating a substrate, the apparatus comprising:
- a chamber having a treating space formed therein;
- a substrate support unit configured to support the substrate in the treating space;
- a gas flow generation unit including a plate located to face the substrate support unit in the treating space, the plate having a plurality of holes formed therein;
- a gas supply line configured to supply gas to some of the holes;
- and
- a gas exhaust line configured to exhaust the gas from other holes,
- wherein the plate has a plurality of first supply holes and a plurality of first exhaust holes formed in a first area thereof and a plurality of second supply holes and a plurality of second exhaust holes formed in a second area thereof, wherein the first area contains the center of the plate, and the second area surrounds the first area.
4 more elements
Dependencies are inferred from the claim text.