Resin molding apparatus
AssigneeAbic Yamada Corporation
InventorsMasahiko Fujisawa, Hirofumi Saito
Life of this patent
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Abstract
A resin molding apparatus that can prevent a workpiece from deflecting during transfer and prevent the occurrence of molding defects due to the deflection is provided. A resin molding apparatus according to the present invention includes a molding mold that molds a workpiece on which an electronic component is mounted inside a carrier with a resin and a loader that transfers the workpiece, the loader includes a chuck that comes into contact with and separates from an outer edge part on a lower surface of the workpiece, a moving device that moves the chuck, and a frame that comes into contact with and separates from an outer edge part on an upper surface of the workpiece, and at least during transfer, the workpiece is able to be interposed between the chuck and the frame.
Claims19
A resin molding apparatus, comprising:
- a molding mold that molds a workpiece on which an electronic component is mounted inside a carrier with a resin;
- and
- a loader that transfers the workpiece,
- wherein the loader comprises a chuck that comes into contact with and separates from an outer edge part on a lower surface of the workpiece, a moving device that moves the chuck, and a frame that comes into contact with and separates from an outer edge part on an upper surface of the workpiece, and
- wherein, at least during transfer, the workpiece is able to be interposed between the chuck and the frame,
- the chuck and the fame are provided as a plurality of types of assemblies corresponding to a plurality of types of workpieces having different outer diameters, and
- the loader is able to attach/detach and operate the assemblies.
Dependencies are inferred from the claim text.