Package structure and manufacturing method thereof

A manufacturing method of package structure, comprising:

• forming polymer ring patterns;
• providing conductive through vias on the polymer ring patterns and providing semiconductor dies beside the polymer ring patterns, wherein each of the conductive through vias comprises a conductive pattern and a seed layer pattern, a first surface of the seed layer pattern contacts the conductive pattern, a second surface of the seed layer pattern contacts the polymer ring patterns, and the second surface of the seed layer pattern is opposite to the first surface of the seed layer pattern;
• laterally encapsulating the semiconductor dies, the conductive through vias and the polymer ring patterns with an insulating encapsulant;
• forming a redistribution structure over the insulating encapsulant, the conductive through vias and the semiconductor dies, wherein the redistribution structure is electrically connected to the conductive through vias and the semiconductor dies;
• disposing conductive terminals on the redistribution structure;
• and
• removing the polymer ring patterns to expose the seed layer patterns of the conductive through vias.

A manufacturing method of package structure, comprising:

• forming polymer ring patterns;
• providing conductive through vias contacting the polymer ring patterns and providing semiconductor dies beside the polymer ring patterns and the conductive through vias;
• laterally encapsulating the semiconductor dies, the conductive through vias and the polymer ring patterns with an insulating encapsulant;
• forming a redistribution structure over the insulating encapsulant, the conductive through vias and the semiconductor dies, wherein the redistribution structure is electrically connected to the conductive through vias and the semiconductor dies;
• disposing conductive terminals on the redistribution structure;
• and
• removing the polymer ring patterns to form recess rings in the insulating encapsulant exposing the conductive through vias.