Imaging for monitoring thickness in a substrate cleaning system
AssigneeApplied Materials, Inc.
InventorsDominic J. Benvegnu, Jun Qian, Boguslaw A. Swedek, Thomas H. Osterheld
Life of this patent
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Abstract
A substrate cleaning system includes a cleaner module to clean a substrate after polishing of the substrate, a drier module to dry the substrate after cleaning by the cleaner module, a substrate support movable along a first axis from a first position in the drier module to a second position outside the drier module, and an in-line metrology station including a line-scan camera positioned to scan the substrate as the substrate is held by the substrate support and the substrate support is between the first position to the second position. The first axis is substantially parallel to a face of the substrate as held in by the substrate support.
Claims14
A substrate cleaning system, comprising:
- a cleaner module to clean a substrate after polishing of the substrate;
- a drier module to dry the substrate after the substrate is cleaned by the cleaner module, wherein the drier module comprises a tank to hold a rinse bath;
- a substrate support movable along a first axis that is substantially parallel to a face of the substrate as held by the substrate support;
- and
- an in-line metrology station including a line-scan camera positioned and configured to scan a portion of the substrate that is out of the rinse bath to obtain a part of an image of the substrate whilst the substrate is partially immersed in the rinse bath.
Dependencies are inferred from the claim text.