Inverse tone pillar printing method using organic planarizing layer pillars
AssigneeInternational Business Machines Corporation
InventorsNelson Felix, Ekmini Anuja De Silva, Praveen Joseph, Ashim Dutta
Life of this patent
Estimating the term…
Loading patent…
AssigneeInternational Business Machines Corporation
InventorsNelson Felix, Ekmini Anuja De Silva, Praveen Joseph, Ashim Dutta
Estimating the term…
An initial semiconductor structure includes an underlying substrate, a hard mask stack, an organic planarization layer (OPL), a first complementary material, and a patterned photoresist layer patterned into a plurality of photoresist pillars defining a plurality of photoresist trenches. The first material is partially etched inward of the trenches, to provide trench regions, and the photoresist is removed. The trench regions are filled with a second complementary material, preferentially etchable with respect to the first material. A polymer brush is grafted on the second material but not the first material, to form polymer brush regions with intermediate regions not covered by the brush. The first material is anisotropically etched the at the intermediate regions but not the brush regions. The OPL is etched inward of the intermediate regions, to provide a plurality of OPL pillars defining a plurality of OPL trenches inverted with respect to the photoresist pillars.
A method comprising:
Dependencies are inferred from the claim text.