Copper electrodeposition sequence for the filling of cobalt lined features

An electroplating system comprising:

• a first bath reservoir configured to contain a first electrolyte solution, the first electrolyte solution comprising an alkaline copper-complexed solution;
• a second bath reservoir configured to contain a second electrolyte solution, the second electrolyte solution comprising an acidic copper plating solution;
• a clamp to:
• hold a substrate and to submerge the substrate in the first electrolyte solution,
• remove the substrate from the first electrolyte solution, and
• submerge the substrate in the second electrolyte solution after the substrate is removed from the first electrolyte solution, the substrate comprising at least some features deposited with a cobalt layer;
• and
• a first anode to be submerged in the first electrolyte solution;
• a second anode to be submerged in the second electrolyte solution;
• and
• a direct current power supply to generate a first direct current between the clamp and the first anode and configured to electroplate a first copper layer on the cobalt layer of the in the first electrolyte solution, and further to generate a second direct current between the clamp and the second anode and configured to electroplate a second copper layer on the first copper layer of the substrate in the second electrolyte solution.