Method for forming patterned mask layer
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYu-Chen Chang, Chien-Wen Lai, Chih-Min Hsiao
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYu-Chen Chang, Chien-Wen Lai, Chih-Min Hsiao
Estimating the term…
A method for forming a patterned mask layer is provided. The method includes forming a first layer over a substrate. The method includes forming a first strip structure and a second strip structure over the first layer. The method includes forming a spacer layer conformally covering the first strip structure, the second strip structure, and the first layer. The method includes forming a block structure in the first trench. The method includes removing a first portion of the spacer layer, which is under the first trench and not covered by the block structure, and a second portion of the spacer layer, which is over the first strip structure and the second strip structure. The method includes forming a third strip structure in the second trench and the third trench. The method includes removing the block structure. The method includes removing the spacer layer.
A method for forming a patterned mask layer, comprising:
A method for forming a patterned mask layer, comprising:
A method for forming a patterned mask layer, comprising:
Dependencies are inferred from the claim text.