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US 11,699,552 B2Granted
Multilayer ceramic electronic component
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsSuji Kang, Dongjin Kim, Jinkyung Park
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AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsSuji Kang, Dongjin Kim, Jinkyung Park
Estimating the term…
A multilayer ceramic electronic component includes: a ceramic body including a dielectric layer containing strontium (Sr) and first and second internal electrodes alternately stacked with the dielectric layer interposed therebetween; and a first external electrode and a second external electrode connected to the first and second internal electrode, respectively, in which the dielectric layer includes a first region parallel to and adjacent to the first internal electrode or the second internal electrode and having a thickness of 50 nm or less, and a second region parallel to and adjacent to the first region, and the first region has an average content of strontium (Sr) greater than 0.1 mol % and less than 9.3 mol %, and the second region has a lower average content of strontium (Sr) than that of the strontium of the first region.
A multilayer ceramic electronic component, comprising:
Dependencies are inferred from the claim text.
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From the US filing history. Foreign family members aren’t listed.
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Characterised by the ceramic dielectric material: based on titanium oxides or titanates
Electrodes: form of non-self-supporting electrodes
Terminals: electrically connecting two or more layers of a stacked or rolled capacitor
Fixed capacitors; Processes of their manufacture: stacked capacitors
About 15 years 4 months of term left · ends 16 Feb 2042 (estimated)
This application claims benefit of priority to Korean Patent Applications Nos. 10-2020-0189537 filed on Dec. 31, 2020 and 10-2021-0176745 filed on Dec. 10, 2021 in the Korean Intellectual Property Office, the disclosures of which are incorporated herein by reference in its entirety.
The present disclosure relates to a multilayer ceramic electronic component.
In accordance with a recent trend for the miniaturization of electronic products, multilayer ceramic electronic components have also been required to be miniaturized and to have high capacitance. Dielectric sheets of multilayer ceramic electronic components are also becoming thinner to meet the demand for miniaturization and high capacitance of multilayer ceramic electronic components.
The above and other aspects, features, and advantages of the present disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:
FIG. 1 is a perspective view schematically illustrating a multilayer ceramic electronic component according to an exemplary embodiment in the present disclosure;
FIG. 2 is a schematic perspective view illustrating a ceramic body of FIG. 1;
Hereinafter, exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings.
In the drawings, an X direction refers to a first direction, an L direction, or a length direction, a Y direction refers to a second direction, a W direction, or a width direction, and a Z direction refers to a third direction, a T direction, or a thickness direction.
FIG. 1 is a perspective view schematically illustrating a multilayer ceramic electronic component according to an exemplary embodiment in the present disclosure, FIG. 2 is a perspective view illustrating a multilayer ceramic electronic component of FIG. 1, and FIG. 3 is a cross-sectional view taken along line I-I′ of FIG. 1. FIG. 4 is an enlarged view of region A of FIG. 3, and FIG. 5 is an enlarged view of region B of FIG. 4.