US 11,699,550 B2Granted

Inductor structure

AssigneeRealtek Semiconductor Corp.

InventorsHsiao-Tsung Yen, Chih-Yu Tsai, Kai-Yi Huang

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Abstract

An inductor structure includes a first curve metal component, a second curve metal component, a connection component, and a capacitor. The first and the second curve metal components are disposed on a layer. The layer is located at a first plane, the first and the second curve metal components are located at a second plane. The connection component is coupled to the first curve metal component and the second curve metal component. A first terminal of the connection component is coupled to a first terminal of the first curve metal component. A second terminal of the connection component is coupled to a first terminal of the second curve metal component. A first terminal of the capacitor is coupled to a second terminal of the first curve metal component. A second terminal of the capacitor is coupled to a second terminal of the second curve metal component.

Claims12

Dependent claims

An inductor structure, comprising:

a first curve metal component, disposed on a layer, wherein the layer is located at a first plane, the first curve metal component is located at a second plane, and the first plane is perpendicular to the second plane;
a second curve metal component, disposed on the layer, wherein the second curve metal component is located at the second plane;
a connection component, coupled to the first curve metal component and the second curve metal component;
and
a capacitor, wherein a first terminal of the connection component is coupled to a first terminal of the first curve metal component, and a second terminal of the connection component is coupled to a first terminal of the second curve metal component, wherein a first terminal of the capacitor is coupled to a second terminal of the first curve metal component, and a second terminal of the capacitor is coupled to a second terminal of the second curve metal component,
wherein a first pad of the first curve metal component and a second pad of the first curve metal component are disposed at the same layer,
wherein a distance from the first pad to the second pad is about 200 um to 300 um.

4 more elements

An inductor structure, comprising:

a first curve metal component, disposed on a layer, wherein the layer is located at a first plane, the first curve metal component is located at a second plane, and the first plane is perpendicular to the second plane;
a second curve metal component, disposed on the layer, wherein the second curve metal component is located at the second plane;
a connection component, coupled to the first curve metal component, the second curve metal component, and a center-tapped terminal of a spiral-shaped inductor,
wherein the center-tapped terminal of the spiral-shaped inductor is connected to the first curve metal component and the second curve metal component through the connection component;
and
a first switch, wherein a first terminal of the first switch is coupled to a first terminal of the first curve metal component, and a second terminal of the first switch is coupled to a first terminal of the spiral-shaped inductor.

3 more elements

Dependencies are inferred from the claim text.

Facts

Application: 17/086,637Filed 2 Nov 2020 · division
Priority: TW 10414211915 Dec 2015
Published: US 2021/0050147 A118 Feb 2021
Granted: 11 Jul 2023
Term ends: Not estimatedThe source records don’t support an estimate.

Classification9 codes

H01F 27/40
Details of transformers or inductances, in general: structural association with built-in electric component, e.g. fuse
H01F 17/0006
Fixed inductances of the signal type: printed inductances
H01F 27/2804
Coils; Windings; Conductive connections: printed windings
H01F 27/29
Coils; Windings; Conductive connections: terminals; Tapping arrangements for signal inductances

Family

Application15/199,956Parent of this division · filed 30 Jun 2016
US 2021/0050147 A1Pre-grant publication · published 18 Feb 2021
US 10,867,746 B2Parent of this division
US 2017/0169939 A1Published application
US 11,699,550 B2This patent

From the US filing history. Foreign family members aren’t listed.