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US 11,699,058 B2Granted
Systems and methods for overmolding a card to prevent chip fraud
AssigneeCapital One Services, LLC
InventorsDaniel Herrington, Stephen Schneider, Tyler Maiman
Life of this patent
Estimating the term…
Abstract
Systems and methods for overmolding a card are provided. A chip fraud prevention system include a device including a chip and a substrate. The chip may be at least partially encompassed in a chip pocket, and the substrate may be at least partially encompassed by the overmold.
Claims20
A card, comprising:
- a substrate including a crimped corner;
- a chip pocket formed within the substrate;
- a chip at least partially positioned with the chip pocket;
- and
- an overmold including a corner pocket, wherein:
- the overmold at least partially encompasses the substrate, and
- the corner pocket at least partially encompasses the crimped corner.
4 more elements
A method of making a card, comprising:
- providing a substrate;
- forming a chip pocket using one or more layers of substrate;
- positioning a chip at least partially within the chip pocket;
- crimping a corner of the substrate;
- flowing an overmold material over the crimped corner;
- and
- solidifying the overmold material.
4 more elements
A chip fraud prevention system, comprising:
- a substrate including a crimped corner;
- a chip pocket formed within the substrate;
- a chip at least partially positioned with the chip pocket;
- and
- an overmold at least partially encompassing the substrate,
- wherein the overmold at least partially encompasses the crimped corner.
3 more elements
Dependencies are inferred from the claim text.