Passively cooling hardware components
AssigneeGoldman, Sachs & Co.
InventorMichael Mattioli
Life of this patent
Estimating the term…
Abstract
A system and a method are disclosed for placing hardware components on a printed circuit board (“PCB”) in a way that enables all hardware components on the PCB to be passively cooled without using active cooling systems. Components are selected to be placed onto the PCB and heat metrics for each component is obtained (e.g., from a server). The components are ranked based on the amount of heat that each component generates. A corresponding position for each of the hardware components is determined based on the ranking of the components and the orientation of the PCB. The placement is based on the concept that air having higher temperature rises while air having cooler temperature falls. A representation of the PCB according to corresponding positions of the hardware components may be generated for display.
Claims17
A method for positioning passively cooled components on a printed circuit board (PCB), the method comprising:
- receiving a plurality of identifiers of a plurality of hardware components, the plurality of hardware components configured to be placed on the PCB;
- determining a ranking for each of the plurality of hardware components based on heat generation metrics including a plurality of values representing amounts of heat generated by the plurality of hardware components;
- identifying a lower edge of the PCB based on an orientation of the PCB while the PCB is in an enclosure;
- selecting one or more highest ranked hardware components from the plurality of hardware components for assignment to locations along the lower edge of the PCB, the one or more highest ranked hardware components including the hardware component having a value representing a highest amount of heat amongst the plurality of hardware components;
- assigning each of the plurality of hardware components a corresponding location on the PCB based on the orientation of the PCB and a value from the plurality of values that represents an amount of heat generated by the hardware component, wherein the selected one or more highest ranked hardware components are assigned to a location along the lower edge of the PCB;
- and
- generating a representation of the PCB and the plurality of hardware components for display, the representation generated according to the assigned location of each of the plurality of hardware components.
A non-transitory computer-readable medium comprising memory with instructions encoded thereon for positioning passively cooled components on a printed circuit board (PCB), the instructions when executed causing one or more processors to perform operations comprising:
- receiving a plurality of identifiers of a plurality of hardware components, the plurality of hardware components configured to be placed on the PCB;
- determining a ranking for each of the plurality of hardware components based on heat generation metrics including a plurality of values representing amounts of heat generated by the plurality of hardware components;
- identifying a lower edge of the PCB based on an orientation of the PCB while the PCB is in an enclosure;
- selecting one or more highest ranked hardware components from the plurality of hardware components for assignment to locations along the lower edge of the PCB, the one or more highest ranked hardware components including the hardware component having a value representing a highest amount of heat amongst the plurality of hardware components;
- assigning each of the plurality of hardware components a corresponding location on the PCB based on the orientation of the PCB and a value from the plurality of values that represents an amount of heat generated by the hardware component, wherein the selected one or more highest ranked hardware components are assigned to a location along the lower edge of the PCB;
- and
- generating a representation of the PCB and the plurality of hardware components for display, the representation generated according to the assigned location of each of the plurality of hardware components.
A system for positioning passively cooled components on a printed circuit board (PCB), the system comprising:
- memory storing instructions;
- and
- one or more processors configured to execute the instructions that cause the one or more processors to perform operations including:
- receiving a plurality of identifiers of a plurality of hardware components, the plurality of hardware components configured to be placed on the PCB;
- determining a ranking for each of the plurality of hardware components based on heat generation metrics including a plurality of values representing amounts of heat generated by the plurality of hardware components;
- identifying a lower edge of the PCB based on an orientation of the PCB while the PCB is in an enclosure;
- selecting one or more highest ranked hardware components from the plurality of hardware components for assignment to locations along the lower edge of the PCB, the one or more highest ranked hardware components including the hardware component having a value representing a highest amount of heat amongst the plurality of hardware components;
- assigning each of the plurality of hardware components a corresponding location on the PCB based on the orientation of the PCB and a value from the plurality of values that represents an amount of heat generated by the hardware component, wherein the selected one or more highest ranked hardware components are assigned to a location along the lower edge of the PCB;
- and
- generating a representation of the PCB and the plurality of hardware components for display, the representation generated according to the assigned location of each of the plurality of hardware components.
Dependencies are inferred from the claim text.