Substrate hydrophilizing agent
AssigneeDaicel Corporation
InventorYuichi Sakanishi
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Abstract
Provided is a substrate hydrophilizing agent that improves the wettability of a substrate surface with respect to a photoresist. A substrate hydrophilizing agent of the present invention is an agent for hydrophilizing a surface of a substrate on which a pattern is formed through photolithography, and contains at least the following Component (A) and Component (B). Component (A): a water-soluble oligomer having a weight average molecular weight from 100 to less than 10000. Component (B): water. The water-soluble oligomer of Component (A) is preferably a compound represented by the following Formula (a-1): Ra1O—(C3H6O2)n—H (a-1) (where Ra1 represents a hydrogen atom, a hydrocarbon group which may have a hydroxyl group, or an acyl group; and n is an integer from 2 to 60.)
Claims13
A substrate hydrophilizing agent for hydrophilizing a surface of a substrate on which a pattern is formed through photolithography, the substrate hydrophilizing agent comprising at least Components (A) and (B) below:
- Component (A):
- a water-soluble oligomer having a weight average molecular weight from 100 to less than 10000, and
- Component (B):
- water,
- wherein a content of the Component (A) is from 1.5 wt. % to 5.0 wt. % of a total amount of the substrate hydrophilizing agent.
A method of producing a semiconductor element comprising:
- step (1):
- hydrophilizing a semiconductor substrate surface using a substrate hydrophilizing agent comprising at least Components (A) and (B) below:
- Component (A):
- a water-soluble oligomer having a weight average molecular weight from 100 to less than 10000, and
- Component (B):
- water,
- wherein a content of the Component (A) is from 1.5 wt. % to 5.0 wt. % of a total amount of the substrate hydrophilizing agent,
- step (2):
- forming a resist coating film on the hydrophilized semiconductor substrate surface;
- step (3):
- exposing and developing the resist coating film so as to form a resist pattern for lithography;
- and
- step (4):
- etching the substrate using the resist pattern.
Dependencies are inferred from the claim text.