Method and computing device for manufacturing semiconductor device

A method of manufacturing a semiconductor device, the method comprising:

• receiving, by at least one processor, full chip data including specific patterns of a first layout;
• extracting, by the at least one processor, a representative pattern of the first layout from the full chip data;
• generating, by the at least one processor, a vector of the extracted representative pattern;
• generating, by the at least one processor, a first data set based on the generated vector;
• generating, by the at least one processor, a machine learning model by performing machine learning with respect to the first data set;
• executing, by the at least one processor, an optical proximity correction (OPC) with respect to the specific patterns of the first layout by using the machine learning model;
• generating, by the at least one processor, a second layout based on a result of executing the OPC;
• causing, by the at least one processor, to generate a mask;
• and
• causing, by the at least one processor, to manudfacture the semiconductor device based on the mask.

A computing device for manufacturing a mask for manufacturing a semiconductor device, the computing device comprising:

• at least one processor configured to,
• receive full chip data including specific patterns of a first layout,
• extract representative pattern of the first layout from the full chip data,
• generate a vector of the extracted representative pattern,
• generate a first data set based on the generated vector,
• generate a machine learning model by performing machine learning with respect to the first data set,
• execute an optical proximity correction (OPC) with respect to the specific patterns of the first layout by using the machine learning model,
• generate a second layout based on a result of executing the OPC, and
• cause to generate the mask based on the second layout.