Thermal management system for electronic device
AssigneeMeta Platforms Technologies, LLC
InventorsMichael Pope, Cameron Peter Jue, Balaji Chelladurai
Life of this patent
Estimating the term…
Abstract
A headset includes a thermal frame disposed within a housing. A printed circuit board is thermally coupled to the thermal frame. Heat generated by one or more electrical components on the PCB is transmitted to the thermal frame, which distributes the heat uniformly throughout the headset. The thermal frame provides a substantially rigid structural support to which components are coupled and is configured to transfer thermal energy away from the one or more electrical components of the headset and toward an environment located outside of the housing.
Claims19
A headset comprising:
- a housing;
- a printed circuit board including one or more electrical components coupled thereto;
- a thermal frame providing a substantially rigid structural support to which components are coupled, the thermal frame being disposed within the housing and configured to transfer thermal energy away from the one or more electrical components of the headset and toward an environment located outside of the housing, wherein:
- the printed circuit board is coupled to the thermal frame,
- the thermal frame includes a rib configured to direct air flow over the thermal frame and to reduce turbulent air flow within the housing,
- the thermal frame includes a boss extending from the thermal frame and configured to abut a surface of the printed circuit board, the boss configured to receive a force imparted on the printed circuit board and to transfer the force to the thermal frame, and
- the thermal frame is in direct or indirect thermal contact with the one or more electrical components of the headset.
A wearable device comprising:
- a housing including one or more vents disposed proximate an edge of the housing;
- an integrated circuit mounted on a substrate and disposed within the housing;
- and
- a thermal frame coupled to the housing and disposed therein, the thermal frame configured to transfer thermal energy away from the integrated circuit, out of the one or more vents, and toward an environment located outside of the housing, wherein the thermal frame includes a boss extending from the thermal frame and configured to abut a surface of the substrate, the boss configured to receive a force imparted on the substrate and to transfer the force to the thermal frame, the boss is further configured to direct air flow through the housing of the wearable device.
An electronic device comprising:
- a housing configured to be attached to a user, the housing including one or more vents therein;
- one or more electronic components coupled to a substrate;
- a thermal frame disposed within the housing and configured to transfer thermal energy away from the one or more electrical components to an environment located outside of the housing via the one or more vents, wherein the thermal frame includes a boss extending from the thermal frame and configured to receive a force imparted on the substrate and to transfer the force to the thermal frame, the boss is further configured to direct air flow through the housing of the electronic device;
- and
- a heat pipe being configured to transfer thermal energy from at least one of the one or more electrical components to the thermal frame.
Dependencies are inferred from the claim text.