Housing via for semiconductor current sensor
AssigneeMelexis Technologies SA
InventorsTim Vangerven, Appolonius Jacobus Van Der Wiel
Life of this patent
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Abstract
A current sensor is described comprising an integrated circuit for sensing electric currents comprising an active side, the active side comprising at least one sensing element and at least one contact pad and a housing comprising material embedding the integrated circuit arranged for allowing electric connection to the at least two contact pads of the active side of the integrated circuit. The housing comprises at least one conductive via disposed outside the integrated circuit and connected to the at least one contact pad, for distributing signals from the at least one contact pad through the housing away from the active side of the integrated circuit.
Claims13
A current sensor comprising:
- a semiconductor integrated circuit for sensing electric currents comprising an active side, the active side comprising at least one sensing element and at least one contact pad;
- a housing comprising material including mold compound embedding the semiconductor integrated circuit arranged for allowing electric connection to the at least one contact pad of the active side of the semiconductor integrated circuit;
- a primary leadframe for carrying current for sensing;
- and
- a set of electric contacts for signal interchange;
- wherein the housing comprises at least one conductive via disposed outside the semiconductor integrated circuit and connected to the at least one contact pad, for distributing signals from the at least one contact pad through the housing away from the active side of the semiconductor integrated circuit,
- wherein the active side of the semiconductor integrated circuit faces the primary leadframe for sensing current therefrom, the semiconductor integrated circuit being electrically isolated from the primary leadframe, the at least one contact pad of the semiconductor integrated circuit further being electrically connected to electric contacts of the set through the conductive vias, for transferring measurement signals to a secondary leadframe.
A method of fabrication of a sensor comprising:
- providing a semiconductor integrated circuit comprising an active side, the active side comprising at least one sensing element and at least one contact pad;
- disposing at least the semiconductor integrated circuit on a carrier substrate;
- providing a housing including at least one conductive via and mold compound, by overmolding the semiconductor integrated circuit, the overmolding being adapted for allowing provision of electric connection to the at least one contact pad of the active side of the semiconductor integrated circuit;
- providing electric connection between the at least one contact pad and the at least one conductive via, thus obtaining a sensor where electric signals generated on the active side of the semiconductor integrated circuit can be redirected through the housing and away from the active side;
- providing a primary leadframe for providing current to be measured, and assembling the housing and the semiconductor integrated circuit thereon with the active side of the semiconductor integrated circuit facing the primary leadframe, the semiconductor integrated circuit being electrically isolated from the primary leadframe;
- providing a set of electric contacts, and electrically connecting at least one of the electric contacts to the conductive via.
Dependencies are inferred from the claim text.