Micromechanical device with elastic assembly having variable elastic constant

A micromechanical device, comprising:

• a semiconductor body;
• a first mobile structure including:
• a first mass;
• a plurality of stopper extensions extending from the first mass;
• and
• a plurality of electrode extensions extending from the first mass, each electrode extension being between two of the stopper extensions;
• and
• a second mobile structure having a first side and a second side opposite one another, and a third and a fourth side opposite one another and transverse to the first and second sides of the second mobile structure, the second mobile structure including:
• a central opening;
• first, second, and third recesses extending from the central opening toward the first side of the second mobile structure, the first recess being larger than the second recess, the first recess being between the second and third recesses, a first one of the plurality of electrode extensions extending into the first recess;
• fourth, fifth, and sixth recesses extending from the central opening toward the second side of the second mobile structure, the fourth recess being larger than the fifth recess, the fourth recess being between the fifth and sixth recesses, ones of the plurality of stopper extensions extending into the second, third, fifth, and sixth recesses, a second one of the plurality of electrode extensions extending into the fourth recess;
• a seventh recess extending from the central opening toward the third side of the second mobile structure;
• an eighth recess extending from the central opening toward the fourth side of the second mobile structure, the eight recess being opposite the seventh recess;
• a first elastic assembly mechanically coupled to the first mobile structure and to the semiconductor body, the first elastic assembly being in the seventh recess;
• a second elastic assembly mechanically coupled to the first mobile structure and to the semiconductor body, the second elastic assembly being in the eighth recess;
• and
• a first fixed electrode coupled to the semiconductor body and between the first and second mobile structures, the first fixed electrode being in the first recess of the second mobile structure.

A micromechanical device, comprising:

• a semiconductor body;
• a first mobile structure including:
• a first mass;
• a first stopper element extending from the first mass;
• and
• a first electrode extending from the first mass;
• a second mobile structure including:
• a second mass larger than the first mass of the first mobile structure;
• an opening in a central region of the second mass, the first mass being in the opening of the second mass;
• a first recess extending from the opening to a first side of the second mobile structure, the first stopper element extending into the first recess;
• and
• a second recess extending from the opening to the first side of the second mobile structure, the second recess is larger than and opposite the first recess, the first electrode of the first mobile structure extending into the second recess of the second mobile structure;
• a first fixed electrode coupled to the semiconductor body and between the first mobile structure and the second mobile structure, the first fixed electrode being in the second recess of the second mobile structure;
• and
• a second fixed electrode coupled to the semiconductor body and between the first mobile structure and the second mobile structure, the second fixed electrode being in the second recess of the second mobile structure, the first electrode being between the first and second fixed electrodes.