Three-dimensional heat dissipating device

#The disclosure relates to a heat dissipating device. More particularly, the disclosure relates to a three-dimensional heat dissipating device.

#In present, a heat dissipating structure includes a vapor chamber and a heat pipe, and is provided with characteristics of thermal conduction, light weight and simple structure. Accordingly, the heat dissipating structure has been widely applied in the field of high-performance heat dissipation. For example, the vapor chamber and the heat pipe of the heat-conducting structure are bonded to each other through a soldering process.

#However, solder materials might be easily overflowed to penetrate into the heat pipe during the soldering process. Thereby, not only affecting the bonding effect of welding, but also affecting the product yield, so as to reduce the work efficiency of the heat dissipating structure.

#The accompanying drawings are included to provide a further understanding of the disclosure, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the disclosure and, together with the description, serve to explain the principles of the disclosure. In the drawings,

#FIG. 1 is a partially exploded view of a three-dimensional heat dissipating device according to one embodiment of the disclosure;

#FIG. 2 is a partial cross section view of an area M of the three-dimensional heat dissipating device of FIG. 1;

#Reference will now be made in detail to the present embodiments of the disclosure, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts. According to the embodiments, it will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the disclosure without departing from the scope or spirit of the disclosure.

#Reference is now made to FIG. 1 to FIG. 2, in which FIG. 1 is a partially exploded view of a three-dimensional heat dissipating device 10 according to one embodiment of the disclosure, and FIG. 2 is a partial cross section view of an area M of the three-dimensional heat dissipating device 10 of FIG. 1. As shown in FIG. 1 and FIG. 2, the three-dimensional heat dissipating device 10 includes a vapor chamber 100 and a plurality of (e.g., two) heat pipes 200. The vapor chamber 100 includes a cover body 110 and a case body 120 which are sealed to each other so as to form the inner cavity 121 between the cover body 110 and the case body 120. One surface (referred to as top surface 111 hereinafter) of the cover body 110 facing away from the case body 120 is provided with a plurality of (e.g., two) first joints 130. The first joints 130 are spaced arranged on the top surface 111 of the cover body 110. Each of the first joints 130 extends outwardly from the top surface 111 of the cover body 110, and each of the first joints 130 is formed with a passage 131 that is in communication with the inner cavity 121. Each of the passages 131 of the first joints 130 is provided with a long axis direction 131A, and the long axis directions 131A of the passages 131 are parallel to one another. The case body 120 is provided with an inner surface 122 and an bottom surface 123 which are opposite to each other.

#Each of the heat pipes 200 is provided with a pipe body 210 and one second joint 220. In the embodiment, each of the pipe body 210 is in a linear shape, and a long axis direction 211 of the pipe body 210 is coaxially aligned with the long axis direction 131A of each of the passage 131, and the long axis direction 211 (i.e., normal direction of the top surface) of the pipe body 210 is perpendicular to the top surface 111 of the cover body 110. One end of the pipe body 210 is an enclosed end 222, and the other end of the pipe body 210 is connected to the second joint 220. The pipe body 210 is formed with a pipe space 212 extending along the long axis direction 131A of the passage 131. In the embodiment, the second joint 220 is connected to surround the other end of the pipe body 210, and gradually expands outwardly from the other end of the pipe body 210 radially in a direction facing away from the pipe body 210 and the first joint 130 such that the second joint 220 surrounds to form a cone-shaped space 223. A maximum diameter (referred to D1) of the cone-shaped space 223 is greater than a maximum diameter (referred to D2) of the pipe space 212.