Surface features for locating net substrate buttons to enable self-piercing riveting (SPR) on brittle and low toughness materials
AssigneeFord Global Technologies, LLC
InventorsAndrey Ilinich, Amanda Freis, Garret Huff
Life of this patent
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Abstract
A method includes identifying a location of a locating feature disposed on an exterior profile of a lower substrate, the locating feature configured to identify a specified location of the exterior profile, positioning a self-piercing rivet along an upper substrate according to the identified location of the locating feature, and installing the self-piercing rivet through the upper substrate and into the lower substrate.
Claims19
A method of joining two substrates with a self-piercing rivet, the method comprising:
- positioning an upper substrate;
- positioning a dimpled substrate adjacent to the upper substrate so that an upper surface of the dimpled substrate faces toward the upper substrate and a lower surface faces away from the upper substrate, the dimpled substrate comprising:
- a preformed interior cavity defined in the upper surface of the dimpled substrate;
- a preformed exterior profile extending from the lower surface of the dimpled substrate, the preformed exterior profile being adjacent the preformed interior cavity and defining a wall therebetween;
- and
- a locating feature configured to identify a location of the at least one preformed exterior profile and visible when the dimpled substrate is positioned adiacent to the upper substrate;
- identifying a location of the locating feature using an automated vision system;
- positioning an installation tool adjacent to the locating feature;
- and
- installing the self-piercing rivet through the upper substrate and into the dimpled substrate.
A method of joining two substrates with a self-piercing rivet, the method comprising:
- identifying, via an automated vision system, a location of a locating feature disposed on a lower substrate, the lower substrate including an exterior profile, the locating feature configured to identify a specified location of the exterior profile;
- positioning a self-piercing rivet along an upper substrate according to the identified location of the locating feature;
- and
- installing the self-piercing rivet through the upper substrate and into the lower substrate.
A method for joining two substrates, the method comprising:
- inserting a self-piercing rivet to an installation tool;
- positioning an upper substrate and a dimpled substrate adjacent to each other so that an upper surface of the dimpled substrate opposes the upper substrate and a lower surface of the dimpled substrate faces away from the upper substrate, the dimpled substrate comprising:
- a preformed exterior profile that extends away from the upper substrate and defines a preformed interior cavity open toward the upper substrate;
- and
- a locating feature disposed on the dimpled substrate and configured to identify a location of the preformed exterior profile and visible when the dimpled substrate is positioned adjacent to the upper substrate;
- identifying, with an automated vision system, a location of the locating feature on the dimpled substrate;
- positioning the installation tool above the upper substrate based on the location of the locating feature;
- and
- actuating the installation tool to pierce the upper substrate with an insertion end of the self-piercing rivet and to move the insertion end into the preformed interior cavity of the dimpled substrate.
Dependencies are inferred from the claim text.