System and method for vapor deposition coating of extrusion dies using impedance disks

A method of depositing an inorganic material on an extrusion die comprising a face comprising a plurality of slots and a plurality of extrusion die pins, the method comprising:

• flowing one or more deposition gases into a vapor deposition chamber of a vapor deposition system, such that the gases travel through a plurality of through holes in an impedance disk disposed in the vapor deposition chamber, then the gases travel through the extrusion die disposed in the vapor deposition chamber, and into the plurality of slots to deposit inorganic particles on side walls of the plurality of pins, wherein a total impedance to the flow of the one or more deposition gases across the impedance disk and the extrusion die is equal to a disk impedance of the impedance disk plus a die impedance of the extrusion die, wherein the through holes comprise a center-to-center lateral spacing and the feed holes comprise a center-to-center lateral spacing, and wherein a value of the center-to-center lateral spacing of the through holes is within 60% of that of the center-to-center-lateral spacing of the feed holes, and wherein the disk impedance is at least 40% of the total impedance to the flow of the one or more deposition gases.

A method of depositing an inorganic material on an extrusion die comprising a face comprising a plurality of slots and a plurality of extrusion die pins, the method comprising:

• flowing one or more deposition gases into a vapor deposition chamber of a vapor deposition system, such that the gases travel through a plurality of through holes in an impedance disk disposed in the vapor deposition chamber, then the gases travel through the extrusion die disposed in the vapor deposition chamber, and into the plurality of slots to deposit inorganic particles on side walls of the plurality of pins, wherein a total impedance to the flow of the one or more deposition gases across the impedance disk and the extrusion die is equal to a disk impedance of the impedance disk plus a die impedance of the extrusion die, wherein the through holes comprise a center-to-center lateral spacing and the feed holes comprise a center-to-center lateral spacing, wherein the center-to-center lateral spacing of the through holes is within 10% of the center-to-center lateral spacing of the feed holes, and wherein the disk impedance is at least 40% of the total impedance to the flow of the one or more deposition gases.

A method of depositing an inorganic material on an extrusion die comprising a face comprising a plurality of slots and a plurality of extrusion die pins, the method comprising:

• flowing one or more deposition gases into a vapor deposition chamber of a vapor deposition system, such that the gases travel through a plurality of through holes in an impedance disk disposed in the vapor deposition chamber, then the gases travel through the extrusion die disposed in the vapor deposition chamber, and into the plurality of slots to deposit inorganic particles on side walls of the plurality of pins, wherein a total impedance to the flow of the one or more deposition gases across the impedance disk and the extrusion die is equal to a disk impedance of the impedance disk plus a die impedance of the extrusion die, wherein the vapor deposition chamber comprises a chamber wall surrounding the extrusion die, and wherein the chamber wall comprises a minimum internal cross-sectional dimension measured perpendicular to the flow of the one or more deposition gases within the vapor deposition chamber, and wherein the extrusion die comprises an effective diameter equal to at least 70% of the minimum internal cross-sectional chamber dimension, and wherein the disk impedance is at least 40% of the total impedance to the flow of the one or more deposition gases.