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US 11,697,754 B2Granted
Thermal conductive layer, photosensitive layer, photosensitive composition, manufacturing method for thermal conductive layer, and laminate and semiconductor device
AssigneeFUJIFILM Corporation
InventorsKosuke Yamashita, Kazuto Shimada
Life of this patent
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Abstract
The present invention relates to a thermal conductive layer that includes at least one filler, has a thermal diffusivity of 5.0×10−7 m2s−1 or more, and has a volume resistivity of 1.0×1011 Ω·cm or more. Further, the present invention relates to a photosensitive layer to which the thermal conductive layer is applied, a photosensitive composition, a manufacturing method for a thermal conductive layer, and a laminate and a semiconductor device.
Claims19
A thermal conductive layer comprising:
- at least one filler,
- wherein the thermal conductive layer has a thermal diffusivity of 5.0×10−7 m2s−1 or more and a volume resistivity of 1.0×1011 Ω·cm or more,
- wherein the thermal conductive layer is formed of a photosensitive layer comprising the at least one filler and a photosensitive material,
- wherein a content of the at least one filler of the photosensitive layer is 70% by mass or less with respect to the total mass of the photosensitive layer,
- wherein the filler has an aspect ratio of 5 or more,
- wherein a content of the at least one filler of the photosensitive layer is 20% to 60% by volume with respect to the total volume of the photosensitive layer.
3 more elements
A thermal conductive layer comprising:
- at least one filler,
- wherein the thermal conductive layer has a thermal diffusivity of 5.0×10−7 m2s−1 or more and a volume resistivity of 1.0×1011 Ω·cm or more,
- wherein the thermal conductive layer is formed of a layer comprising the at least one filler, an alkali-soluble resin, and a polymerizable monomer,
- wherein a content of the at least one filler of the layer is 70% by mass or less with respect to the total mass of the layer,
- wherein the filler has an aspect ratio of 5 or more,
- wherein a content of the at least one filler of the layer is 20% to 60% by volume with respect to the total volume of the layer.
3 more elements
A thermal conductive layer comprising:
- at least one filler,
- wherein the thermal conductive layer has a thermal diffusivity of 5.0×10−7 or more and a volume resistivity of 1.0×1011 Ω·cm or more,
- wherein the thermal conductive layer is formed of a layer comprising the at least one filler and a polyimide precursor,
- wherein the filler has an aspect ratio of 5 or more,
- wherein a content of the at least one filler of the layer is 20% to 60% by volume with respect to the total volume of the layer.
2 more elements
Dependencies are inferred from the claim text.