Bone-conduction sensor assembly
AssigneeAac Acoustic Technologies (Shenzhen) Co., Ltd.
InventorsTingting Hong, Zhenkui Meng, Kai Wang
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Abstract
The present disclosure provides a bone-conduction sensor assembly. The bone-conduction sensor assembly includes a housing, a printed circuit board assembly forming a first receiving cavity together with the housing, a diaphragm accommodated in the first receiving cavity, a MEMS die and an ASIC chip mounted on the printed circuit board assembly. The MEMS die electrically connects to the ASIC chip through a bonding wire. A first weight is located on a surface of the diaphragm facing to the printed circuit board assembly. A position of the first weight has an avoiding portion corresponding to the bonding wire.
Claims7
A bone-conduction sensor assembly, comprising:
- a housing;
- a printed circuit board assembly forming a first receiving cavity together with the housing;
- a diaphragm accommodated in the first receiving cavity;
- a MEMS die and an ASIC chip mounted on the printed circuit board assembly, the MEMS die electrically connected to the ASIC chip through a bonding wire;
- a first weight located on a surface of the diaphragm facing to the printed circuit board assembly, a position of the first weight having an avoiding portion corresponding to the bonding wire.
Dependencies are inferred from the claim text.