Surface micromechanical element and method for manufacturing the same
AssigneeTeknologian tutkimuskeskus VTT Oy
InventorsAarne Oja, Jaakko Saarilahti
Life of this patent
Estimating the term…
Abstract
The present publication discloses a micromechanical structure including at least one active element, the micromechanical structure comprising a substrate, at least one layer formed on the substrate forming the at least part of the at least one active element, mechanical contact areas through which the micromechanical structure can be connected to other structures like printed circuit boards and like. In accordance with the invention the micromechanical structure includes weakenings like trenches around the mechanical contact areas for eliminating the thermal mismatch between the active element of the micromechanical structure and the other structures.
Claims7
An arrangement comprising:
- a microelectromechanical, MEMS, structure including at least one active element, the MEMS structure comprising a substrate, at least one layer formed on the substrate forming at least part of the at least one active element, mechanical contact areas through which the MEMS structure is connectable to other structures, and trench weakenings included around the mechanical contact areas for eliminating thermal mismatch between the at least one active element of the MEMS structure and the other structures, and
- an integrated circuit distinct from the MEMS structure, wherein
- the MEMS structure comprises an encapsulation, the MEMS structure being assembled directly on the integrated circuit, the integrated circuit forming part of the encapsulation,
- wherein the integrated circuit comprises a substrate of a semiconductor material.
Dependencies are inferred from the claim text.