Method and tool for molding an electronic module, and molded electronic module
AssigneeZF Friedrichshafen AG
InventorsMarco Knier, Thomas Deichler, Christoph Schikora
Life of this patent
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AssigneeZF Friedrichshafen AG
InventorsMarco Knier, Thomas Deichler, Christoph Schikora
Estimating the term…
A method may include coating an electronic module in a tool, where the electronic module has a first sub-module and a second sub-module, where the tool has a first tool part and a second tool part, where the tool has a cavity at least partially formed between the first tool part and the second tool part, and where the first sub-module and the second sub-module are supported on the tool and held in the cavity at a spatially defined distance relative to one another in a contactless manner during the coating process. A tool for performing such method may include a first tool part and a second tool part that form a cavity, where the first tool part has a first molding surface section and at least one first supporting section that extends over the first molding surface section and the second tool part has a second molding surface section and at least one second supporting section that extends over the second molding surface section.
A tool for coating an electronic module, the tool comprising:
A tool for coating an electronic module, the tool comprising:
Dependencies are inferred from the claim text.