Temperature-based assymetry correction during CMP and nozzle for media dispensing

A chemical mechanical polishing apparatus comprising:

• a rotatable platen to hold a polishing pad;
• a rotatable carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process;
• a first actuator to oscillate the carrier across the polishing pad;
• a polishing liquid supply port to supply a polishing liquid to the polishing surface;
• a thermal control system including a movable nozzle to spray a medium onto the polishing surface to adjust a temperature of a zone on the polishing surface;
• a second actuator to move the nozzle radially relative to an axis of rotation of the platen;
• and
• a controller configured to coordinate dispensing of the medium from the nozzle with motion of the nozzle across the polishing surface to generate a plurality of radial annular zones of different temperatures and to synchronize oscillation of the carrier with rotation of the carrier to periodically align one or more angular swaths of the substrate with one of the radial annular zones.