Fabrication of a polishing pad for chemical mechanical polishing

A method of forming a polishing pad, comprising:

• forming a porous top pad;
• and
• adhering the porous top pad to a sub-pad,
• wherein forming the porous top pad comprises:
• providing a solution of a block copolymer (BCP) on a support substrate, wherein the BCP includes a first segment and a second segment connected to the first segment, the second segment being different from the first segment in composition;
• treating the BCP solution such that the BCP assembles into an interpenetrating polymer network having a first phase and a second phase embedded in the first phase, wherein the first phase includes the first segment and the second phase includes the second segment, and wherein the interpenetrating polymer network has a substantially periodic pattern;
• removing the second phase from the interpenetrating polymer network, thereby forming a polymer film that includes a network of pores embedded in the first phase;
• and
• removing the polymer film from the support substrate.

A method of forming a polishing pad, comprising:

• forming a porous top pad;
• and
• adhering the porous top pad to a sub-pad,
• wherein forming the porous top pad comprises:
• providing a solution of a block copolymer (BCP) on a support substrate, wherein the BCP includes a first segment and a second segment connected to the first segment, the second segment being different from the first segment in composition;
• treating the BCP solution by supplying a thermodynamic driving force for ample time to
• reach thermodynamic equilibrium, to form a polymer matrix having a first continuous phase and a second continuous phase embedded in the first continuous phase, wherein the first continuous phase includes the first segment and the second continuous phase includes the second segment;
• removing the second continuous phase from the polymer matrix, thereby forming a polymer film that includes a network or pores embedded in the first continuous phase porous top pad;
• and
• removing the polymer film from the support substrate.