Quantum information processing device formation
AssigneeGoogle Inc.
InventorAnthony Edward Megrant
Life of this patent
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Abstract
A method for forming at least part of a quantum information processing device is presented. The method includes providing a first electrically-conductive layer formed of a first electrically-conductive material (100′) on a principal surface of a substrate (10), depositing a layer of dielectric material on the first electrically-conductive material, patterning the layer of dielectric material to form a pad of dielectric material and to reveal a first region of the first electrically-conductive layer, depositing a second electrically-conductive layer (104′) on the pad of dielectric material and on the first region of the first electrically-conductive layer, patterning the second electrically-conductive layer and removing the pad of dielectric material using isotropic gas phase etching.
Claims22
A method, comprising:
- forming at least part of a quantum information processing device, comprising:
- providing a first electrically-conductive layer formed of a first electrically-conductive material on a principal surface of a substrate;
- patterning the first electrically-conductive layer into a first electrically-conductive base, a second electrically-conductive base, and a center electrically-conductive strip arranged between the first electrically-conductive base and the second electrically-conductive base, wherein the center electrically-conductive strip is separated from the first electrically-conductive base and the second electrically-conductive base by a first window in the first electrically-conductive layer and a second window in the first electrically-conductive layer, respectively;
- depositing a layer of dielectric material on the first electrically-conductive material;
- patterning the layer of dielectric material to form a pad of dielectric material and to reveal a first region of the first electrically-conductive layer and a second region of the first electrically-conductive layer, wherein the first region is on the first electrically-conductive base and the second region is on the second electrically-conductive base;
- depositing a second electrically-conductive layer on the pad of dielectric material, on the first region, and on the second region of the first electrically-conductive layer;
- patterning the second electrically-conductive layer to obtain a bridge structure, wherein the bridge structure spans the center electrically-conductive strip;
- and
- removing the pad of dielectric material using isotropic gas phase etching.
Dependencies are inferred from the claim text.