Liquid immersion cooling tank with variable flow for high density computer server equipment
AssigneeTyco Fire & Security GmbH
InventorsMichael J Sweeney, David Patrick Selmser, John Bernard Zwicker, Shahreen Beente Haider
Life of this patent
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Abstract
An immersion cooling system includes an electronic component, a thermally conductive dielectric liquid, and a tank defining a tank interior configured to receive the electronic component and the thermally conductive dielectric liquid for cooling the electronic component. The immersion cooling system also includes a wall positioned external to the tank to coordinate with the tank to define an overflow gap extending between the tank and the wall. The overflow gap is configured to receive an overflow of the thermally conductive dielectric liquid from the tank interior.
Claims26
An immersion cooling system, comprising:
- an electronic component;
- a thermally conductive dielectric liquid;
- a tank defining a tank interior configured to receive the electronic component and the thermally conductive dielectric liquid for cooling the electronic component;
- a wall positioned external to the tank to coordinate with the tank to define an overflow gap extending between the tank and the wall, wherein the overflow gap is configured to receive an overflow of the thermally conductive dielectric liquid from the tank interior;
- an outlet fluidly coupled with the overflow gap and configured to drain the thermally conductive dielectric liquid from the overflow gap;
- at least one sensor configured to detect at least one ambient or operating condition associated with the immersion cooling system;
- and
- a controller configured to:
- receive sensor data indicative of the at least one ambient or operating condition from the at least one sensor;
- and
- control, based on the sensor data, a pump configured to circulate the thermally conductive dielectric liquid through the immersion cooling system, a heat exchanger configured to cool the thermally conductive dielectric liquid, or both.
An immersion cooling system, comprising:
- a tank defining a tank interior configured to receive an electronic component and a thermally conductive dielectric liquid for cooling the electronic component;
- a perforated plate of the tank, wherein perforations of the perforated plate are configured to receive a flow of the thermally conductive dielectric liquid and distribute the thermally conductive dielectric liquid to the tank interior;
- at least one sensor configured to detect at least one ambient or operating condition associated with the immersion cooling system;
- and
- a controller configured to:
- receive sensor data indicative of the at least one ambient or operating condition from the at least one sensor;
- and
- control, based on the sensor data, a pump configured to circulate the thermally conductive dielectric liquid through the immersion cooling system, a heat exchanger configured to cool the thermally conductive dielectric liquid, or both.
An immersion cooling system, comprising:
- an electronic component;
- a thermally conductive dielectric liquid;
- a tank defining a tank interior configured to receive the electronic component and the thermally conductive dielectric liquid for cooling the electronic component, wherein the tank comprises a plate with openings through the plate that are configured to receive a flow of the thermally conductive dielectric liquid and distribute the thermally conductive dielectric liquid to the tank interior;
- a wall positioned external to the tank to coordinate with the tank to define an overflow gap extending between the tank and the wall, wherein the overflow gap is configured to receive an overflow of the thermally conductive dielectric liquid from the tank interior;
- at least one sensor configured to detect at least one ambient or operating condition associated with the immersion cooling system;
- and
- a controller configured to:
- receive sensor data indicative of the at least one ambient or operating condition from the at least one sensor;
- and
- control, based on the sensor data, a pump configured to circulate the thermally conductive dielectric liquid through the immersion cooling system, a heat exchanger configured to cool the thermally conductive dielectric liquid, or both.
Dependencies are inferred from the claim text.