High power multilayer module having low inductance and fast switching for paralleling power devices
AssigneeWolfspeed, Inc.
InventorsMatthew Feurtado, Brice McPherson, Daniel Martin, Alexander Lostetter
Life of this patent
Estimating the term…
Loading patent…
AssigneeWolfspeed, Inc.
InventorsMatthew Feurtado, Brice McPherson, Daniel Martin, Alexander Lostetter
Estimating the term…
A power module including at least one substrate, a housing arranged on the at least one power substrate, a first terminal electrically connected to the at least one power substrate, a second terminal including a contact surface, a third terminal electrically connected to the at least one power substrate, a plurality of power devices arranged on and connected to the at least one power substrate, and the third terminal being electrically connected to at least one of the plurality of power devices. The power module further including a base plate and a plurality of pin fins arranged on the base plate and the plurality of pin fins configured to provide direct cooling for the power module.
A power module, comprising:
A power module, comprising:
A power module, comprising:
Dependencies are inferred from the claim text.