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US 11,696,409 B2Granted
Vertical embedded component in a printed circuit board blind hole
AssigneeIntel Corporation
InventorsTin Poay Chuah, Min Suet Lim, Hoay Tien Teoh, Mooi Ling Chang, Chin Lee Kuan
Life of this patent
Estimating the term…
Abstract
A printed circuit board (PCB) comprises a blind via and a discrete component vertically embedded within the blind via.
Claims14
A printed circuit board (PCB) comprising:
- a blind via in a layer of the PCB, the layer of the PCB having an uppermost surface;
- a discrete component vertically embedded within the blind via;
- a solder paste pad on the discrete component, the solder paste pad extending laterally beyond the blind via, wherein a portion of the solder paste pad is vertically overlapping with the uppermost surface of the layer of the PCB;
- and
- a stencil on the uppermost surface of the layer of the PCB, the stencil laterally surrounding and in lateral contact with the solder paste pad, wherein the discrete component is vertically embedded under a ball grid array coupling the PCB to an integrated circuit (IC) package, and wherein a solder ball of the ball grid array is vertically over and coupled to the discrete component by the solder paste pad.
2 more elements
A printed circuit board (PCB) comprising:
- a via connecting an outer layer of the PCB with one or more inner layers of the PCB, wherein an uppermost one of the one or more inner layers has an uppermost surface;
- a discrete component vertically embedded within the via;
- a solder paste pad on the discrete component, the solder paste pad extending laterally beyond the via, wherein a portion of the solder paste pad is vertically overlapping with the uppermost surface of the uppermost one of the one or more layers of the PCB;
- and
- a stencil on the uppermost surface of the uppermost one of the one or more layers of the PCB, the stencil laterally surrounding and in lateral contact with the solder paste pad, wherein the discrete component is vertically embedded under a ball grid array coupling the PCB to an integrated circuit (IC) package, and wherein a solder ball of the ball grid array is vertically over and coupled to the discrete component by the solder paste pad.
2 more elements
Dependencies are inferred from the claim text.