Flexible printed circuit board and method of manufacturing flexible printed circuit board
AssigneesSumitomo Electric Industries, Ltd., Sumitomo Electric Printed Circuits, Inc.
InventorsKoji Nitta, Yasushi Mochida, Yoshio Oka, Shoichiro Sakai, Tadahiro Kaibuki, Junichi Okaue
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Abstract
A flexible printed circuit board includes a base film having an insulating property, and multiple interconnects laminated to at least one surface side of the base film. The multiple interconnects include a first interconnect and a second interconnect in a same plane. An average thickness of the second interconnect is greater than an average thickness of the first interconnect. A ratio of the average thickness of the second interconnect to the average thickness of the first interconnect is greater than or equal to 1.5 and less than or equal to 50.
Claims9
A flexible printed circuit board comprising:
- a base film having an insulating property;
- and
- a plurality of interconnects laminated to at least one surface side of the base film,
- wherein the plurality of interconnects includes a plurality of first interconnects and a plurality of second interconnects in a same plane, an average thickness of each of the plurality of second interconnects being greater than an average thickness of each of the plurality of first interconnects,
- wherein a ratio of the average thickness of each of the plurality of second interconnects to the average thickness of each of the plurality of first interconnects is greater than or equal to 1.5 and less than or equal to 50,
- wherein each of the plurality of first interconnects and the plurality of second interconnects includes a conductive underlayer and a plating layer, the conductive underlayer being laminated to an upper surface of the base film,
- wherein a thickness of the conductive underlayer of each of the plurality of first interconnects is substantially equal to a thickness of the conductive underlayer of each of the plurality of second interconnects,
- wherein a thickness of the plating layer of each of the plurality of second interconnects is greater than a thickness of the plating layer of each of the plurality of first interconnects, and
- wherein a line width of the conductive underlayer of each of the plurality of second interconnects is greater than a line width of the conductive underlayer of each of the plurality of first interconnects,
- wherein an interval between the conductive underlayers of two second interconnects among the plurality of second interconnects is greater than an interval between the conductive underlayers of two first interconnects among the plurality of first interconnects.
Dependencies are inferred from the claim text.