Electronic control apparatus and method for producing an electronic control apparatus
AssigneeVitesco Technologies Germany GmbH
InventorsMartin Steinau, Karl Maron
Life of this patent
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Abstract
The disclosure provides an electronic control apparatus including a printed circuit board with a first surface side and a second surface side and with at least one electronic component that is arranged on at least one of the surface sides of the printed circuit board. At least one heat sink is arranged on the printed circuit board on the opposite surface side from the electronic component for the purpose of heat dissipation. The printed circuit board with the electronic component and the heat sink are surrounded by a casing made from a thermosetting plastic material such that at least one outer side of the heat sink is free of thermosetting plastic material.
Claims12
An electronic control apparatus comprising:
- a printed circuit board with a first surface side and a second surface side and with at least one electronic component that is arranged on at least one of the first and second surface sides of the printed circuit board, and
- at least one heat sink is arranged on the printed circuit board on the opposite surface side from the electronic component for heat dissipation, wherein the printed circuit board with the electronic component and the heat sink is surrounded by a casing made from a thermosetting plastic material such that at least one outer side of the heat sink is free of thermosetting plastic material;
- and
- a ribbed profile being part of the at least one heat sink, the ribbed profile extending away from a first side of the at least one heat sink, and the printed circuit board in contact with a second side of the at least one heat sink.
A method for producing an electronic control apparatus, comprising a printed circuit board with a first surface side and a second surface side and with at least one electronic component that is arranged on at least one of the surface sides of the printed circuit board;
- wherein at least one heat sink is arranged on the printed circuit board on the opposite surface side from the electronic component for heat dissipation;
- wherein the printed circuit board with the electronic component and the heat sink is surrounded by a casing made from a thermosetting plastic material such that at least one outer side of the heat sink remains free of thermosetting plastic material;
- and
- wherein a ribbed profile is part of the at least one heat sink, the ribbed profile extending away from a first side of the at least one heat sink, and the printed circuit board in contact with a second side of the at least one heat sink.
A method for producing an electronic control apparatus, the method comprising:
- arranging at least one electronic component on at least one surface side of a printed circuit board having a first surface and a second surface;
- arranging at least one heat sink on the printed circuit board on the opposite surface side from the electronic component for the purpose of heat dissipation, such that a ribbed profile being part of the at least one heat sink extends away from a first side of the at least one heat sink, and the printed circuit board is in contact with a second side of the at least one heat sink;
- and
- surrounding the printed circuit board with the electronic component and the heat sink by a casing made from a thermosetting plastic material such that at least one outer side of the heat sink remains free of thermosetting plastic material.
Dependencies are inferred from the claim text.