Imaging apparatus, and moving object
AssigneeCanon Kabushiki Kaisha
InventorYoko Shimizu
Life of this patent
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Abstract
An imaging apparatus is mounted on a moving object and configured to capture an image while moving along a moving direction of the moving object. The imaging apparatus includes a sensor unit including a sensor substrate on which an image sensor is mounted, and a main unit including a main substrate on which an electronic component configured to process an output signal from the sensor substrate is mounted. The imaging apparatus further includes a heat dissipation fin configured to dissipate heat generated in at least one of the sensor unit and the main unit. The heat dissipation fin is provided in a direction substantially parallel to the moving direction.
Claims22
An imaging apparatus mounted on a moving object and configured to capture an image while moving along a moving direction of the moving object, the imaging apparatus comprising:
- a sensor unit including a sensor substrate on which an image sensor is mounted;
- a main unit including a main substrate on which an electronic component configured to process an output signal from the sensor substrate is mounted;
- a heat sink cover on which a component of the sensor unit is disposed;
- a pair of arm portions on the heat sink cover;
- and
- a heat dissipation fin configured to dissipate heat generated in at least one of the sensor unit and the main unit,
- wherein the heat dissipation fin is provided between the pair of arm portions and in a direction substantially parallel to the moving direction, and{grave over ( )}
- wherein the sensor substrate and the main substrate are connected to each other by at least a connection wire passing through inside the arm portions.
An imaging apparatus mounted on a moving object and configured to capture an image while moving along a moving direction of the moving object, the imaging apparatus comprising:
- a sensor unit including a sensor substrate on which an image sensor is mounted;
- a main unit including a main substrate on which an electronic component configured to process an output signal from the sensor substrate is mounted;
- a heat sink cover on which a component of the sensor unit is disposed;
- a pair of arm portions on the heat sink cover;
- and
- a heat dissipation unit configured to dissipate heat generated in at least one of the sensor unit and the main unit,
- wherein the heat dissipation unit is provided so as to cause an outside air to flow in a direction substantially parallel to the moving direction, and the heat dissipation unit is provided between the pair of arm portions, and
- wherein the sensor substrate and the main substrate are connected to each other by at least a connection wire passing through inside the arm portions.
An imaging apparatus comprising:
- an optical system including a lens;
- a sensor unit including a sensor substrate including an image sensor;
- a main unit including a main substrate;
- an interface unit including an external interface;
- a heat sink cover on which a component of the sensor unit is disposed;
- and
- a pair of arm portions on the heat sink cover and a heat dissipation fin between the pair of arm portions exposed to an outside and provided on a surface on an opposite side of the lens,
- wherein at least one of the arm portions is fixed to the main unit or the interface unit, and
- wherein a connection wire used to electrically connect the sensor unit and the main unit to each other is disposed inside the at least one of the arm portions.
A moving object on which an imaging apparatus is mounted, the imaging apparatus comprising:
- a sensor unit including a sensor substrate on which an image sensor is mounted;
- a main unit including a main substrate on which an electronic component configured to process an output signal from the sensor substrate is mounted;
- a heat sink cover on which a component of the sensor unit is disposed;
- a pair of arm portions on the heat sink cover;
- and
- a heat dissipation fin configured to dissipate heat generated in at least one of the sensor unit and the main unit,
- wherein the heat dissipation fin is provided in a direction substantially parallel to a moving direction of the moving object, and
- wherein the sensor substrate and the main substrate are connected to each other by at least a connection wire passing through inside the arm portions.
Dependencies are inferred from the claim text.